+ CG-860 is a displace
immersion thin gold solution which just developed for the SMT
and IC Packaging surface treatment (solderability, connectivity).
So before immersion gold...
+ CG-871 is developed
as a new immersion medium thick gold to make The gold plating
layer in 3 ~ 8 u ".The thickest gold plating layer can
reach up to 10 u " . CG-871 also can be used to common
plating thin gold...
+ Introduction:A-180 is specially designed for removing epoxy resin
during plastic injection while IC Packaging
Process. A-180 can
remove resin in 60°C~80°C.
...
+ ME-102 is an additive for PCB copper surface micro-erosion, and it mixed proportionally with PPS can form an excellent copper surface micro-etching liquid for printed circuit boards. ...
+ BJ-101 is a stabilizer of hydrogen peroxide micro-etching series, and it mixed proportionally with sulfuric acid-hydrogen peroxide can form a copper surface micro-etching liquid...
+ CC-810 acid Cleaner is designed to HDI board development of citric acid type of products , using special interface surfactant, washing and cleaning power of good, do not damage...
+
EC-168 is designed to compatible with
PCB surface cleaning of alkalic defatted
products，It is a alkalic cleaner aqueous
solution, The alkalic cleaner is designed
to remove off grease、oxide and scum
on the...
+ EC-102 acid cleaner is designed to remove off grease、oxide and scum on the copper surface .Especially compatible with OSP be used apply to cleaning selective Ni/Au PCB...
+ EC-103 is EC-103 is a special acid cleaner aqueous solution designed to compatible with PCB surface cleaning,such as to remove off grease、oxide and scum on the surface of PCB...
+ The process of OSP (Organic Solderability Preservatives) are based on benzimidazole,all kinds of benzimidazole derivatives have been developed,The company’s products...
page 2 Totol 2 pages to page
Total 17 item
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