CG-860 is a displace immersion thin gold solution which just developed for the SMT and IC Packaging surface treatment (solderability, connectivity). So before immersion gold, it is need to full deposit nickel (thickness 4um or more) on the base and select suitable electroless nickel as basic layer. for this purpose, we recommend using CN – 851 series electroless nickel solution.

1、Make Up :
CG-860: 100 ml/L
KAu(CN)2: 0.8g/L (0.6-2.5 g/L)

2. Procedure :
Temp：86℃ (85 ~ 90℃)
Time: 1~6min(dual gold bath process 1 min)
Tanks material: PP or FRP
Heater: PTFE heat exchanger or quartz.
Filtration: 5~10μm PP filter core, 4~6 turn-over/hr
Churning: Circulation pump
Vibration: Air cylinder
Rinse: 3 times by DI. water (dual gold bath process nonuse)
Other: leave out

3.Solution Maintenance :
1)regular addition: CG-860: 15~20mL/m2
2)Update: 4 M.T.O.，copper ions content above 5ppm or nickel ions content above 500ppm