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SiO2 Nanocolloids ProductNew  
 
Nanocolloids Product Catalogue
Nanocolloids particle size distribution charts(the laseranalysis chart)
Acid High speed Nicke/Gold plating solution for PCB  
 
PLATEC HA-780 High speed hard Gold plating acid process
PLATEC HN High speed Nickel plating process
PCB OSP (Organic Solderability Preservatives)  
 
Platec F-22G Organic SolderabilityPreservatives For LeadfreeSoldering And selective Ni/Au boards
PLATEC F22 (Leadfree Soldering)
PCB ENIG (Electroless Nickel/Immersion Gold)  
 
PLATEC Accelerant Activator CP-842/ CP-842R
PLATEC Electroless Nickel CN-851M/A/B/C/D
PLATEC Immersion thin Gold CG-860
PLATEC Immersion medium thick Gold CG-871
PLATEC Electroless Nickel CN-857 / M / A / B / C / D
PLATEC Electroless Nickel SN-558 / M / A / B / C / D
PLATEC Electroless Nickel MVN-9 / M / A / B / C / D
PLATEC Immersion thin Gold SG-568 M / R
PLATEC Immersion thin Gold PRG-99
PLATEC Electroless Nickel palladium Gold NPD-522
PLATEC Immersion thin Gold PG-656 M / R / F
Chemical Resin release solution for IC Packaging  
 
A-180 Semi-Conductor Chemical Resin release liquid
Semi-Conductor Copper electrolyle anolyte and catholyte  
 
Copper electrolyle
Acid /Alkalic Cleaner  
 
PLATEC Acid Cleaner PDS-1
PLATEC Acid Cleaner CC-810
PLATEC Alkalic Cleaner EC-168
PLATEC Acid Cleaner EC-102
PLATEC Acid Cleaner EC-103
PLATEC Acidic cleaner PL-158
Benzimidazole derivatives  
 
Benzimidazole derivatives
Copper surface Micro-etching  
 
PLATEC Copper Micro-etching Additive ME-102New
PLATEC Micro-etching Stabilizer BJ-101New
 
Products Home > Products
 
 Nanocolloids Product Catalogue
+ Product Characteristic:
Nano scale of SiO2 particle dispersion solution. Particles are spherical in shape and particle ……


 
 Nanocolloids particle size distribution charts(the laseranalysis chart)
+ please refer to the details page


 
 PLATEC HA – 780( High speed hard Gold plating acid process)
+ PLATEC HA – 780( High speed hard gold plating acid process) is an acid chelate cobalt system and organic brightener system High speed gold plating process, which suitable for connectors、terminals...


 
  PLATEC HN( High speed Nickel plating process)
+ PLATEC HN is a low stress and semi-bright nickel plating process, which was designed especially for the high speed nickel plating under high current density operation condition,Which can be used continual...


 
 Platec F22G Organic Solderability Preservatives (Leadfree Soldering And selective Ni/Au boards)
+ F22G Application and Feature:
Application：It is suitable for rigid and flexible PWBs，as well as IC packing with leadfree requirements......


 
 PLATEC F22 Organic Solderability Preservative (Leadfree Soldering)
+ F22 Application and Feature:
Application：It is suitable for rigid and flexible PWBs，as well as IC packing with leadfree requirements...


 
 PLATEC Accelerant Activator CP-842/ CP-842R
+ CP-842/CP-842R is a kind of traditional but very excellent palladium sulphate type of Accelerant Activator.Comparing with the products of their type on the market which damage to copper surface...


 
 PLATEC Electroless Nickel CN-851M/A/B/C/D
+ CN-851 is a nickel-phosphorus alloy chemical plating solution, which Rev-Plating capability is good and the solution stability is excellent, The plating layer phosphorus contain is stable, The plating layer is good...


 
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