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Products Home > Products > PLATEC Electroless Nickel palladium Gold NPD-522
 
PLATEC Electroless Nickel palladium Gold NPD-522

NPD-522 M
NPD-522 B
NPD-522 C
NPD-522 D

Product features：
NPD-522 is a surface treatment SMT and W / B for the purpose of reduction of palladium plating chemicals, has superior reliability of lead-free soldering.
Use NPD-522 is recommended with PLATEC the ENIG CN-851 or CN-857 or soft ENIG SN-558.
Can be used to the gold wire bonding, the Reliability compared ENIG good.
Gold cost savings.
nickel deposit rate 0.08 ~ 0.12 μm / 10 min (Adjust the dipping time according to the specification.)
Phosphorus content for palladium : 4~6 ％

Solution characteristic：

Wire bonding
Gold wire : 0.8 mil Ni / Pd / Au 5 / 0.05 / 0.05 μm
Test result : ＞6 g
   

 
 
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