Ⅰ.Introduction:
ME-102 is an additive for PCB copper surface micro-erosion, and it mixed proportionally with PPS can form an excellent copper surface micro-etching liquid for printed circuit boards. Its main uses are as follows:
(1) Process micro-erosion before Organic shielded welding process (OSP).
(2) Process micro-erosion before solder coating.
(3) Process micro-erosion before solder masking.
(4) Pretreatment of dry film lamination (inner board and outer board).
(5) Pretreatment of coating copper guard agent (copper surface antioxidant).
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Ⅱ. Product features (1) With good effect of galvani inhibition for chemical board micro-etching.
(2) With no additional acid, easy to operate.
(3) The processed copper surface is of even roughness and fine, with strong
deoxidation
ability.
(4) Little COD, simple to treat wastewater.
(5) With no pungent smell, environmental protection and safety.
(6) Spray and dip type both can be used.
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Ⅲ.Product specification
Appearance: colorless or light yellow liquid
Specific gravity: 1.28 ± 0.05
Acidity: 6±1N
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Ⅳ.Using method
1. Building bath (v/v %):
(1) Pure water: 50%
(2) PPS:20~120g/L (based on customer requirement for micro-etching volume)
(3) ME-102：8～12%
(4) Pure water: allowance
2. Addition of ME-102:
Add after analysis on ME-102 concentration of micro-etching liquid.
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Ⅴ. Conditions for use
(1) Operating temperature: 25~45℃ (based on customer requirement for
micro-etching
volume).
(2) Time for receiving liquid: dip for less than about 1 minute; spray for about
20-50
seconds (depending on equipment parameters).
(3) When dipped, the liquid is required for appropriate mixing, and it is used whe
it is
uniform.
(4) When the majority of boards are centralized for treatment, a certain space
between
boards is kept to avoid duplicated treatment, leading to
over-etching phenomenon.
(5) Wash with water fully after the micro-etching |
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