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SiO2 Nanocolloids ProductNew  
 
Nanocolloids Product Catalogue
Nanocolloids particle size distribution charts(the laseranalysis chart)
Acid High speed Nicke/Gold plating solution for PCB  
 
PLATEC HA-780 High speed hard Gold plating acid process
PLATEC HN High speed Nickel plating process
PCB OSP (Organic Solderability Preservatives)  
 
Platec F-22G Organic SolderabilityPreservatives For LeadfreeSoldering And selective Ni/Au boards
PLATEC F22 (Leadfree Soldering)
PCB ENIG (Electroless Nickel/Immersion Gold)  
 
PLATEC Accelerant Activator CP-842/ CP-842R
PLATEC Electroless Nickel CN-851M/A/B/C/D
PLATEC Immersion thin Gold CG-860
PLATEC Immersion medium thick Gold CG-871
PLATEC Electroless Nickel CN-857 / M / A / B / C / D
PLATEC Electroless Nickel SN-558 / M / A / B / C / D
PLATEC Electroless Nickel MVN-9 / M / A / B / C / D
PLATEC Immersion thin Gold SG-568 M / R
PLATEC Immersion thin Gold PRG-99
PLATEC Electroless Nickel palladium Gold NPD-522
PLATEC Immersion thin Gold PG-656 M / R / F
Chemical Resin release solution for IC Packaging  
 
A-180 Semi-Conductor Chemical Resin release liquid
Semi-Conductor Copper electrolyle anolyte and catholyte  
 
Copper electrolyle
Acid /Alkalic Cleaner  
 
PLATEC Acid Cleaner PDS-1
PLATEC Acid Cleaner CC-810
PLATEC Alkalic Cleaner EC-168
PLATEC Acid Cleaner EC-102
PLATEC Acid Cleaner EC-103
PLATEC Acidic cleaner PL-158
Benzimidazole derivatives  
 
Benzimidazole derivatives
Copper surface Micro-etching  
 
PLATEC Copper Micro-etching Additive ME-102New
PLATEC Micro-etching Stabilizer BJ-101New
 
Products Home > Products > Platec F-22G...
 
Platec F-22G Organic SolderabilityPreservatives For LeadfreeSoldering And selective Ni/Au boards
 
 
F-22G feature:

●lower running cost
●very uniform coating and flat soldering pads
●lower ionic contamination
●no staining on gold finishing
●excellent heat-resistance and solderabilityafter multi-IR reflow
●excellent humidity resistance to prevent copper for approx. 12months
●no staining with higher copper ion

●compatible with lead free SMT process
●compatible with No-cleanSMTprocess
●no VOC risk
●lower operation temperature to protect PWBs construction
●moderate chemical feature , so that no damage Soldermask
 
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