BJ-101 is a stabilizer of hydrogen peroxide micro-etching series, and it mixed proportionally with sulfuric acid-hydrogen peroxide can form a copper surface micro-etching liquid for printed circuit boards. Its main uses are as follows:

       (1) Solder coating pretreatment.
       (2) Process micro-erosion before solder masking.       
       (4) Pretreatment of dry film lamination (inner board and outer board).
       (4) Pretreatment of coating copper guard agent (copper surface antioxidant).
       (5) Pretreatment of composite board blackening

       (1) With good effect of galvani inhibition for chemical board micro-etching.
       (2) A clean roughened copper surface available.
       (3) Eliminate the vitriolization process.
       (4) Little COD, easy for drainage.
       (5) Little excitant odour.
       (6) Spray and dip type both can be used.

       Appearance: light brown liquid
       Specific gravity: 0.995 ± 0.02

      1.Building bath (v/v %) (lower the temperature to room temperature (≦ 28℃) and then add BJ-101 and hydrogen peroxide)
            (1) Pure water: 50%
            (2) CP50% sulfate acid: 2~10%
            (3) BJ-101：8～12%
            (4) 35% hydrogen peroxide: 2-6%
            (5) Pure water: allowance
       2.Addition of BJ-101:
            Add a proportional mix of hydrogen peroxide, and the ratio is 1/5~1/2 of the additive amount of 35% hydrogen peroxide analysis liquid.

      (1) Operating temperature: 20~40℃
       (2) Time for receiving liquid: dip for less than 1 minutes; spray for 20-50 seconds
       (3) When dipped, the liquid is required for appropriate mixing, and it is used whe
             it is uniform.
       (4) When the majority of boards are centralized for treatment, a certain space
             between boards is kept to avoid duplicated treatment, leading to over-etching              phenomenon.
       (5) Wash with water fully after being processed, and dry quickly.