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A-180 Semi-Conductor Chemical Resin release liquid
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Products Home > Products > A-180 Semi-Conductor Chemical Resin release liquid
 
A-180 Semi-Conductor Chemical Resin release liquid
 
 
1. Introduction:
A-180 is specially designed for removing epoxy resin during plastic injection while IC Packaging Process. A-180 can remove resin in 60°C~80°C.

2．Product Feature:

• No need Mechanical Removing Process after used
• No damage for metal base material
• Suitable for all kinds of EMC
• No scent

3．Physics Characteristics:

• Appearance: Transparent Liquid

4．Density（25℃）:

• 1± 0.25（25℃）

5． pH (25±2℃):

• pH=3.9±0.3(25±2℃)

6．Usage:

• No Minglement, direct Using

7．Operation:

• Consistency: Direct using, no dilute required
• Temperature: 60°C ~ 80°C
• Time: Depends on different kinds of expoxy material and parts (20 min ~ 60 min)
 
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