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Acid High speed Nicke/Gold plating solution for PCB  
 
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PLATEC HN High speed Nickel plating process
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Platec F-22G Organic SolderabilityPreservatives For LeadfreeSoldering And selective Ni/Au boards
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PLATEC Accelerant Activator CP-842/ CP-842R
PLATEC Electroless Nickel CN-851M/A/B/C/D
PLATEC Immersion thin Gold CG-860
PLATEC Immersion medium thick Gold CG-871
PLATEC Electroless Nickel CN-857 / M / A / B / C / D
PLATEC Electroless Nickel SN-558 / M / A / B / C / D
PLATEC Electroless Nickel MVN-9 / M / A / B / C / D
PLATEC Immersion thin Gold SG-568 M / R
PLATEC Immersion thin Gold PRG-99
PLATEC Electroless Nickel palladium Gold NPD-522
PLATEC Immersion thin Gold PG-656 M / R / F
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A-180 Semi-Conductor Chemical Resin release liquid
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PLATEC Acid Cleaner CC-810
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Benzimidazole derivatives
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Products Home > Products > PLATEC Electroless Nickel MVN-9 / M / A / B / C / D
 
PLATEC Electroless Nickel MVN-9 / M / A / B / C / D

Product features：
Excellent starting ability and good plating solution stability.
Applicable to all kinds of solder mask.
Adding machine with the automatic analysis of nickel, have stable solution and labor-saving.
Phosphorus content: 8~10 ％.

Reliability Tests：

ITEM

REFERENCE DOCUMENT

RESULT

1

SALT SPRAY TEST

MIL-STD-883G Method 1009.8 specification.

Duration of test：96hours

PASS

2

TEMPERATURE CYCLING TEST

Temperature range：-65°C~ +125°C

Number of cycles：100cycles

PASS

3

TEMPERATURE AND HUMIDITY STORAGE TEST

Temperature：65°C

Humidity：95% RH

Test Time：168hours

PASS


BGA BALL PULL TEST

 
 
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