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奈米二氧化矽SiO2溶膠New |
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印刷電路板酸性高速鍍鎳.
高速鍍金藥水 |
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印刷電路板有機保焊劑藥水 |
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印刷電路板化學鍍鎳.
化學鍍金藥水 |
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IC封裝除膠劑 |
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半導體銅製程陽極電解液.
陰極電解液 |
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酸性,鹼性清潔劑 |
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苯並咪唑 |
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銅表面微蝕劑 |
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| 2013最新產品型號及規格: |
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1
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2
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3
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4
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產品型號
ITEM
|
NANOCO
|
NANOCO
|
NANOCO
|
NANOCO
|
|
AA20
|
AC30
|
AS20
|
BS20
|
 |
|
|
|
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SiO2含量(wt%)
|
20±1
|
30±1
|
20±1
|
20±1
|
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分散溶劑 SOLVENT
|
H2O
|
H2O
|
MeOH
|
IPA
|
|
PH
|
2.0~4.0
|
9.5~10.5
|
2.0~3.0
|
2.0~3.0
|
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平均粒徑(D50,nm)
|
10~30
|
10~30
|
10~30
|
10~30
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黏度(cps@25℃)
|
10max.
|
10max.
|
10max.
|
10max.
|
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比重(@25℃)
|
1.04~1.08
|
1.18~1.22
|
1.04~1.08
|
0.80~0.95
|
|
外觀 Appearance
|
透明溶膠液
clear
|
透明溶膠液
clear
|
透明溶膠液
clear
|
透明溶膠液
clear
|
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水份(wt%)
|
-
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NaOH
|
<1%
|
<1%
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|
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5
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6
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7
|
8
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產品型號
ITEM
|
NANOCO
|
NANOCO
|
NANOCO
|
NANOCO
|
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IS30
|
ZS20
|
ES20
|
OS30
|
|
|
|
|
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SiO2含量(wt%)
|
30±1
|
20±1
|
20±1
|
30±1
|
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分散溶劑 SOLVENT
|
1.4-BDO
|
DMAC
|
BuAC
|
Toluene
|
|
PH
|
2.0~3.0
|
-
|
-
|
-
|
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平均粒徑(D50,nm)
|
10~30
|
10~30
|
10~30
|
10~30
|
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黏度(cps@25℃)
|
500max.
|
100max.
|
100max.
|
100max.
|
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比重(@25℃)
|
1.20~1.26
|
1.04~1.09
|
1.02~1.04
|
1.04~1.07
|
|
外觀 Appearance
|
透明溶膠液
clear
|
透明溶膠液
clear
|
透明溶膠液
clear
|
透明溶膠液
clear
|
|
水份(wt%)
|
<1%
|
<1%
|
<1%
|
<1%
|
|
|
9
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10
|
11
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產品型號
ITEM
|
NANOCO
|
NANOCO
|
NANOCO
|
|
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EP06
|
DS20
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WS20
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 |
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SiO2含量(wt%)
|
6±1
|
20±1
|
20±1
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分散溶劑 SOLVENT
|
BE-188
|
PM
|
HDDA
|
|
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PH
|
-
|
3.0~4.0
|
-
|
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平均粒徑(D50,nm)
|
10~30
|
10~30
|
10~30
|
|
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黏度(cps@25℃)
|
5000max.
|
50max.
|
10max.
|
|
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比重(@25℃)
|
1.15~1.25
|
0.96~1.06
|
1.00~1.20
|
|
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外觀 Appearance
|
透明溶膠液
clear
|
透明溶膠液
|
透明溶膠液
|
|
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水份(wt%)
|
<1%
|
<1%
|
<1%
|
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注：上述規格外，另外可依照客戶要求規格製作。 |
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